BS EN 61192-2-2003 钎焊电子组件的工艺要求.表面安装组件
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【英文标准名称】:Workmanshiprequirementsforsolderedelectronicassemblies-Surface-mountassemblies
【原文标准名称】:钎焊电子组件的工艺要求.表面安装组件
【标准号】:BSEN61192-2-2003
【标准状态】:现行
【国别】:英国
【发布日期】:2003-06-25
【实施或试行日期】:2003-06-25
【发布单位】:英国标准学会(BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:元部件;覆层;材料;训练;质量保证;印制电路板;表面安装设备;包装件;规范(验收);软钎焊连接;规范;分规范;评定;定义;生产;过程控制;设计;电子设备及元件;电气工程;电子装置;电气试验;设备;检验;表面安装;组装件;钎焊
【英文主题词】:Assemblies;Coatings;Components;Definition;Definitions;Design;Electricalengineering;Electricaltesting;Electronicequipmentandcomponents;Electronically-operateddevices;Equipment;Evaluations;Inspection;Materials;Packages;Printed-circuitboards;Processcontrol;Production;Qualityassurance;Sectionalspecification;SMD;Solderedjoints;Solderings;Specification;Specification(approval);Surfacemounting;Training
【摘要】:ThispartofIEC61192specifiesrequirementsforworkmanshipinsolderedsurface-mountedelectronicassembliesandmultichipmodulesonorganicsubstrates,onprintedboards,andonsimilarlaminatesattachedtothesurface(s)ofinorganicsubstrates.Itappliestoassembliesthataretotallysurface-mountedandtothesurface-mountportionsofassembliesthatincludeotherrelatedassemblytechnologies,forexample,through-holemounting.Itdoesnotincludemetalorceramic-basedhybridcircuitsinwhichtheconductormetallizationisdepositeddirectlyonaceramicsubstrateorontoaceramic-coatedmetalsubstrate.
【中国标准分类号】:J33
【国际标准分类号】:31_190
【页数】:68P.;A4
【正文语种】:英语
【原文标准名称】:钎焊电子组件的工艺要求.表面安装组件
【标准号】:BSEN61192-2-2003
【标准状态】:现行
【国别】:英国
【发布日期】:2003-06-25
【实施或试行日期】:2003-06-25
【发布单位】:英国标准学会(BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:元部件;覆层;材料;训练;质量保证;印制电路板;表面安装设备;包装件;规范(验收);软钎焊连接;规范;分规范;评定;定义;生产;过程控制;设计;电子设备及元件;电气工程;电子装置;电气试验;设备;检验;表面安装;组装件;钎焊
【英文主题词】:Assemblies;Coatings;Components;Definition;Definitions;Design;Electricalengineering;Electricaltesting;Electronicequipmentandcomponents;Electronically-operateddevices;Equipment;Evaluations;Inspection;Materials;Packages;Printed-circuitboards;Processcontrol;Production;Qualityassurance;Sectionalspecification;SMD;Solderedjoints;Solderings;Specification;Specification(approval);Surfacemounting;Training
【摘要】:ThispartofIEC61192specifiesrequirementsforworkmanshipinsolderedsurface-mountedelectronicassembliesandmultichipmodulesonorganicsubstrates,onprintedboards,andonsimilarlaminatesattachedtothesurface(s)ofinorganicsubstrates.Itappliestoassembliesthataretotallysurface-mountedandtothesurface-mountportionsofassembliesthatincludeotherrelatedassemblytechnologies,forexample,through-holemounting.Itdoesnotincludemetalorceramic-basedhybridcircuitsinwhichtheconductormetallizationisdepositeddirectlyonaceramicsubstrateorontoaceramic-coatedmetalsubstrate.
【中国标准分类号】:J33
【国际标准分类号】:31_190
【页数】:68P.;A4
【正文语种】:英语
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